test method for exothermic temperature of encapsulating compounds for electronic and microelectronic encapsulation 電子元件及微電子元件封裝用密封化合物發(fā)熱溫度測試方法
standard test method for exothermic temperature of encapsulating compounds for electronic and microelectronic encapsulation 電子元件及微電子元件封裝用密封化合物發(fā)熱溫度的標(biāo)準(zhǔn)試驗方法
test method for fluid and grease resistance of thermoset encapsulating compounds used in electronic and microelectronic applications 用于電子和微電子設(shè)備的熱固性封裝復(fù)合劑的耐液體和油脂的試驗方法
standard test method for fluid and grease resistance of thermoset encapsulating compounds used in electronic and microelectronic applications 電子和微電子學(xué)應(yīng)用的熱固性密封膠的耐流體和滑脂性能的標(biāo)準(zhǔn)試驗方法